Powertrain Modularity & Integration
A Novel Mathematical Approach for Inductor-Current Expressions Definition in Multilevel Dual-Active-Bridge Converters
Audience:
Automotive Component Manufacturers, Electric Powertrain Researchers, Electric Vehicle Powertrain Developers, EV Manufacturers, Power Electronic Engineers
Automotive Component Manufacturers, Electric Powertrain Researchers, Electric Vehicle Powertrain Developers, EV Manufacturers, Power Electronic Engineers
Keyword:
Compact Analytic Expression, Dual Active Bridge, E-Volve Cluster, Fourier Decomposition, Multilevel Converter, Piecewise Analysis, Power Converters, RMS Value, SCAPE
Compact Analytic Expression, Dual Active Bridge, E-Volve Cluster, Fourier Decomposition, Multilevel Converter, Piecewise Analysis, Power Converters, RMS Value, SCAPE
Link:
MDPI
Powertrain Modularity & Integration
Active Thermal Control in Neutral-Point-Clamped Multilevel Converters Based on Switching-Cell Arrays
Neutral-point-clamped multilevel converters are a suitable solution to the implementation of low–medium voltage and power applications at present, thanks to their intrinsic superior voltage and current quality.
Audience:
Electrical Engineers, Electronic Suppliers and Manufacturers, EV Manufacturers, Power Electronic Engineers
Electrical Engineers, Electronic Suppliers and Manufacturers, EV Manufacturers, Power Electronic Engineers
Keyword:
E-Volve Cluster, Multilevel Converter, Neutral-Point-Clamped Multilevel Converter, SCAPE, Switching-Cell Array, Temperature Balancing Control
E-Volve Cluster, Multilevel Converter, Neutral-Point-Clamped Multilevel Converter, SCAPE, Switching-Cell Array, Temperature Balancing Control
Thermal Management
Thermo-Electrical Modeling of Multilevel Switching-Cell-Array-Based Power Converters
Audience:
Electric Powertrain Researchers, EV Manufacturers, Power Electronic Engineers, Researchers in Thermal Management, Thermal Systems Engineers
Electric Powertrain Researchers, EV Manufacturers, Power Electronic Engineers, Researchers in Thermal Management, Thermal Systems Engineers
Link:
IEEE Xplore