Thermal Management
A Top-Side Cooled Package to Best Dissipate Heat
In recent years, semiconductor manufacturers have developed power component packages which use a different thermal management approach - instead of placing the thermal pad on the bottom of a device pointing towards the PCB, the exposed metal pad is placed on the top side of the device.
Audience:
Automotive Component Manufacturers, Electric Vehicle Manufacturers, Thermal Management Researchers, Thermal Systems Engineers
Automotive Component Manufacturers, Electric Vehicle Manufacturers, Thermal Management Researchers, Thermal Systems Engineers
Link:
Full Document
Thermal Management
Thermal Management System Strategies, Modelling and Simulation
This report provides a comprehensive overview of thermal management system strategies, modeling, and simulation within the RHODaS project.
Audience:
Automotive R&D Teams, Control System Designers, HVAC Automotive Professionals, Researchers in Thermal Management, Simulation and Modelling Professionals, Thermal Systems Engineers
Automotive R&D Teams, Control System Designers, HVAC Automotive Professionals, Researchers in Thermal Management, Simulation and Modelling Professionals, Thermal Systems Engineers
Keyword:
Computational Fluid Dynamics, COMSOL Multiphysics, Cooling Systems, E-Volve Cluster, Finite Element Analysis, Heatsink Design, RHODaS, Thermal Interface, Thermal Management System
Computational Fluid Dynamics, COMSOL Multiphysics, Cooling Systems, E-Volve Cluster, Finite Element Analysis, Heatsink Design, RHODaS, Thermal Interface, Thermal Management System
Link:
Rhodas pdf file, Zenodo