Thermal Management
A Top-Side Cooled Package to Best Dissipate Heat
In recent years, semiconductor manufacturers have developed power component packages which use a different thermal management approach - instead of placing the thermal pad on the bottom of a device pointing towards the PCB, the exposed metal pad is placed on the top side of the device.
Audience:
Automotive Component Manufacturers, Electric Vehicle Manufacturers, Thermal Management Researchers, Thermal Systems Engineers
Automotive Component Manufacturers, Electric Vehicle Manufacturers, Thermal Management Researchers, Thermal Systems Engineers
Link:
Full Document
Powertrain Modularity & Integration
Materials Specifications and Requirements for Active and Passive Electronic Components. Selection Matrix and Integration Strategies
This report specifies the active electronic switches and resistive and reactive passive components, as well as converters' materials such as bus-bars and coolers that will be developed in the RHODaS project.
Audience:
Electric Propulsion Researchers, Electrical Engineers, Electronic Suppliers and Manufacturers, EV Manufacturers, Power Electronic Engineers
Electric Propulsion Researchers, Electrical Engineers, Electronic Suppliers and Manufacturers, EV Manufacturers, Power Electronic Engineers
Keyword:
E-Volve Cluster, Electronic Components, Heavy-Duty Electric Transport, Power Converters, RHODaS, Semiconductors
E-Volve Cluster, Electronic Components, Heavy-Duty Electric Transport, Power Converters, RHODaS, Semiconductors
Link:
Rhodas deliverable, Zenodo
Powertrain Modularity & Integration
Selection of Switching-Cell Main Power Semiconductor Devices
This deliverable reports the selection of the optimum power devices for implementing the SCAPE high-voltage switching cells, after a literature review and commercial availability check.
Audience:
Electric Powertrain Researchers, Electric Vehicle Researchers, Electrical Engineering Researchers, European Commission
Electric Powertrain Researchers, Electric Vehicle Researchers, Electrical Engineering Researchers, European Commission
Keyword:
E-Volve Cluster, Power Electronics, SCAPE, Semiconductors, SiC and GaN Devices, Switching-Cell Array, Wide Bandgap Devices
E-Volve Cluster, Power Electronics, SCAPE, Semiconductors, SiC and GaN Devices, Switching-Cell Array, Wide Bandgap Devices
Link:
SCAPE Deliverable